China electronics industry manufacturer & supplier

Al-base Board

1, Material:Burguist
2, Board Thickness:1.5mm
3, Copper Wt:6OZ
4, Solder Mask:GreeN
5, Finish:HAL

2012-09-17

16-layer Hi-Tg Board Blind and Buried Holes

1,Material:FR-4 TG=170
2,Copper Wt for I/O layer:4OZ
3,Layer Count:16-layer
4,Board Thickness:3.0mm
5,Blind & Buried Holes:2-3,1-8,9-16

2012-09-17

Flex-rigid board

1,6Layers+3Layers
2,Copper: 0.5oz
3,Finish: HASL
4,Characteristic impedance

2012-09-17

double-sided

1, Material:PI
2, Board Thickness:0.2mm
3, Line Width/Space:5/5mil
4, Min Hole Size:0.3mm

2012-09-17

4-layer flexible board

1, Layer Count:4-layer
2, Technique:FPC+Rigid PCB
3, Board Thickness:1.0mm
4, Line Width/Space:6/6mil
5, Min Hole Size:0.3mm

2012-09-17

double-sided flexible board

1,Material:PI
2,Board Thickness:0.2mm
3,Line Width/Space:5/5mil
4, Min Hole Size:0.3mm
5,Reinforcement:FR-4 1.0mm...

2012-09-17

PCB Printed Circuit Board

1,Line Width/Space:5/5mil
2,Min Hole Size:0.25mm
3,Solder Mask:Green
4,Finish:HAL

2012-09-17

8-layer HASL

1, Line Width/Space:4/4mil
2, Min Hole Size:0.3mm
3, Solder Mask:Green
4, Vias:BGA filled with ink
5, Finish:HASL(Lead Free)

2012-09-17

18-layer multilayer board

1,layer:18-layer
2,board thickness:6mm
3,size:700mm*1100mm
4,type:burn in board
5,finish:immersion gold

2012-09-17

4-layer gold finger board

1, Min Hole Size:0.3mm
2,Finish:Immersion Au+Gold Finger
3,Vias:BGA filled with ink
4,Thickness:Gold 15U",Nickel 150U

2012-09-17